Display device with two display panel

ABSTRACT

An in-cell touch display panel includes a sensing line. A touch electrode corresponds to more than one pixel electrodes. A first insulation layer is formed on the sensing line and has a first opening to expose the sensing line. A gate of a thin film transistor (TFT) is formed on the first insulation layer. A second insulation layer is formed on a gate line and has a second opening corresponding to the first opening. A source of the TFT is formed on the second insulation layer. A third insulation layer is formed on the source and has a third opening corresponding to the second opening. The touch electrode is formed on the third insulation layer and electrically connected to the sensing line through the third opening, the second opening, and the first opening.

RELATED APPLICATIONS

This application claims priority to China Application Serial Number202010882285.1 filed Aug. 28, 2020, and also is a continuation-in-partof U.S. application Ser. No. 16/836,898, filed Mar. 31, 2020, which is acontinuation of the U.S. application Ser. No. 15/836,933 filed Dec. 11,2017 now U.S. Pat. No. 10,649,566, issued on May 12, 2020, which claimspriority to China Application Serial Number 201611244094.2 filed Dec.29, 2016, all of which are herein incorporated by reference.

BACKGROUND Field of Invention

The present disclosure relates to an in-cell display touch panel. Moreparticularly, the present disclosure relates to the in-cell touchdisplay panel in which a common electrode serves as a touch electrode.

Description of Related Art

A TDDI (Touch with Display Driver Integration) single chip is connectedto data lines and sensing lines which are connected to touch electrodes,thereby enabling the single chip to control both functions of touch anddisplay. It is an issue about how to dispose the sensing lines.

SUMMARY

Embodiments of the present disclosure provide an in-cell touch displaypanel having a display area and a non-display area. The in-cell touchdisplay panel includes the following units. Multiple gate lines andmultiple data lines are intersected with each other on a substrate.Multiple sensing lines are disposed on the substrate. Multiple pixelregions are disposed in areas where the gate lines are intersected withthe data lines, in which each of the pixel regions has a pixelstructure, and each of the pixel structures includes a pixel electrodeformed by a first transparent conductive layer. A touch electrode isformed by a second transparent conductive layer, in which the touchelectrode corresponds to more than one of the pixel electrodes. A thinfilm transistor is formed in each of the pixel structure. The thin filmtransistor includes a gate, a source, a drain and a semiconductor layer.The source is electrically connected to one of the data lines. The gateis electrically connected to one of the gate lines. The drain iselectrically connected to one of the pixel electrodes. A firstinsulation layer is formed on the sensing lines and having a firstopening to expose one of the sensing lines, in which the gate is formedon the first insulation layer. A second insulation layer is formed onthe gate lines and has a second opening corresponding to the firstopening, in which the source is formed on the second insulation layer. Athird insulation layer is formed on the source and has a third openingcorresponding to the second opening. The touch electrode is formed onthe third insulation layer. The touch electrode is electricallyconnected to one of the sensing lines through the third opening, thesecond opening and the first opening.

In some embodiments, the first insulation layer and the secondinsulation layer have same material. The first insulation layer has afirst side in the first opening, the second insulation layer has asecond side in the second opening, and the first side and the secondside form a downhill surface.

In some embodiments, the panel further includes a metal connectionstructure having same material as the data lines, in which the metalconnection structure is formed between the touch electrode and the oneof the sensing lines.

In some embodiments, an etching rate of the first insulation layer isless than an etching rate of the second insulation layer.

In some embodiments, the panel further includes multiple display padsand multiple touch pads in the non-display area. Each of the data linesis electrically connected to one of the display pads. Each of thesensing lines is electrically connected to one of the touch pads. One ofthe display pads is disposed between two of the touch pads, and one ofthe touch pads is disposed between two of the display pads.

In some embodiments, a number of the touch pads is less than a number ofthe display pads. The display pads and the touch pads are arranged asmultiple rows, and one of the rows only consists of the touch pads.

In some embodiments, the display pads and the touch pads are arranged asmultiple rows. A first row only consists of a portion of the displaypads, and a second row includes a portion of the display pads and aportion of the touch pads.

In some embodiments, the display pads and the touch pads are arranged asmultiple rows. In one of the rows, a same number of the display pads aredisposed between any two of the touch pads.

In some embodiments, the non-display area includes a signal linetransferring area and a fan-out area. In the display area, the sensinglines are formed by a first metal layer. In the signal line transferringarea, one of the sensing lines or the data lines is transferred toanother metal layer through a connection structure.

In some embodiments, one of the sensing lines includes a first portionand a second portion. The connection structure includes the followingunits. The first portion is formed by the first metal layer. The firstinsulation layer has a fourth opening to expose the first portion. Thesecond insulation layer has a fifth opening corresponding to the fourthopening. The second portion is formed by a third metal layer on thesecond insulation layer. The third insulation layer has a sixth openingand a seventh opening, in which the sixth opening corresponds to thefourth opening, and the seventh opening exposes the second portion. Thesecond transparent conductive layer is electrically connected to thesecond portion through the seventh opening and electrically connected tothe first portion through the fourth opening, the fifth opening, and thesixth opening.

In some embodiments, the connection structure further includes a metalconnection layer formed by the third metal layer. The metal connectionlayer is formed between the second transparent conductive layer and thefirst portion.

In the aforementioned display panel, the touch electrode may be used ascommon electrode and the sensing line is formed in the first metallayer, a situation of under-cut is avoided.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the followingdetailed description of the embodiment, with reference made to theaccompanying drawings as follows.

FIG. 1 is a schematic diagram illustrating connections of data lines andsensing lines in a touch display panel in accordance with an embodiment.

FIG. 2 is a schematic diagram illustrating connection between thesensing lines and a driving circuit in accordance with an embodiment.

FIG. 3A to FIG. 3F is a schematic diagram illustrating disposition ofdisplay pads and touch pads in accordance with some embodiments.

FIG. 4 is a top view of a pixel structure in accordance with anembodiment.

FIG. 5 is a cross-sectional view of the pixel structure of FIG. 4 alonga cross-sectional line AA′.

FIG. 6 is a cross-sectional view of a connection structure in accordancewith an embodiment.

FIG. 7 is a cross-sectional view of a connection structure in accordancewith an embodiment.

DETAILED DESCRIPTION

Specific embodiments of the present invention are further described indetail below with reference to the accompanying drawings, however, theembodiments described are not intended to limit the present inventionand it is not intended for the description of operation to limit theorder of implementation. Moreover, any device with equivalent functionsthat is produced from a structure formed by a recombination of elementsshall fall within the scope of the present invention. Additionally, thedrawings are only illustrative and are not drawn to actual size.

The using of “first”, “second”, “third”, etc. in the specificationshould be understood for identifying units or data described by the sameterminology but are not referred to particular order or sequence.

FIG. 1 is a schematic diagram illustrating connections of data lines andsensing lines in a touch display panel in accordance with an embodiment.Referring to FIG. 1, in an in-cell touch display panel 100, electrodesfor detecting touch are disposed in pixel structures on a thin filmtransistor (TFT) substrate.

The in-cell touch display panel 100 has a display area 101 and anon-display area 102. The non-display area 102 includes a signal linetransferring area 103 and a fan-out area 104. The display area 101 isdescribed first. The display area 101 includes multiple pixel regionswhich are formed in areas where the gate lines are intersected with thedata lines. Each pixel region has a pixel structure. To be specific, thedisplay area 101 includes: pixel structures P11-P14, P21-P24, P31-P34and P41-P44; gate lines G1-G4 extending along an X direction (alsoreferred to a first direction); data lines D1-D4 extending along a Ydirection (also referred to a second direction), in which the data linesD1-D4 are not connected to each other spatially; and sensing lines S1-S4extending along the Y direction. The data lines D1-D4 are intersectedwith the gate lines G1-G4 on the substrate, and a pixel structure isdisposed in each of the intersection areas. Each pixel structureincludes a thin film transistor (TFT). Each of the data lines D1-D4 iselectrically connected to the source of the TFT in the correspondingpixel structure, and each of the gate lines G1-G4 is electricallyconnected to the gate of the TFT in the corresponding pixel structure.For example, the pixel structure P11 includes a TFT T1 which has a gateT1G and a source T1S. The gate line G1 is electrically connected to thegate T1G, and the data line D1 is electrically connected to the sourceT1S. The display panel also includes a common electrode which ispatterned to form touch electrodes C11, C12, C21 and C22 in the displayarea 101. Each touch electrode corresponds to multiple pixel electrodesand is electrically connected to at least one sensing line through acontact hole 210. For example, the pixel structures P11-P14 correspondto the touch electrode C11 which is electrically connected to thesensing line S1; the pixel structures P21-P24 correspond to the touchelectrode C12 which is electrically connected to the sensing line S3;the pixel structures P31-P34 correspond to the touch electrode C21 whichis electrically connected to the sensing line S2; and the pixelstructures P44-P44 correspond to the touch electrode C22 which iselectrically connected to the sensing line S4.

A period of a frame is at least divided into one or more display periodsand one or more touch sensing periods. During the display period, acommon voltage is applied to the touch electrodes C11, C12, C21, andC22, and the voltage on the gate lines G1-G4 are configured to turn onthe TFTs in the corresponding pixel structures sequentially, and adriving circuit 110 transmits pixel data to the pixel electrodes in thecorresponding pixel structures through the data lines D1-D4 in order toset grey levels of pixels. During the touch sensing period, the touchelectrodes C11, C12, C21, and C22 are used for detecting touchoperations performed on the in-cell touch display panel 100, and thedriving circuit 110 generates a touch sensing signal according to thevoltage variation on the touch electrodes C11, C12, C21, and C22. Inother words, a resolution of touch operation is determined by the numberof the touch electrodes that is less than a resolution of display.

The signal line transferring area 103 is located between the displayarea 101 and the fan-out area 104. In the signal line transferring area103, the data lines D1-D4 and the sensing lines S1-S4 may be transferredto other metal layers. For example, the sensing lines S1-S4 are in afirst metal layer in the display area 101, but are transferred to athird metal layer in the fan-out area 104. Multiple connectionstructures are disposed in the signal line transferring area 103 fortransferring the sensing lines S1-S4 from the first metal layer to thethird metal layer. The embodiment of the connection structure would bedescribed in detail below. In addition, a transparent or opaqueconductive layer may be disposed in the signal line transferring area103 to prevent the in-cell touch display panel 100 from damage byelectrostatic discharge.

Display pads 121-124 and touch pads 131-134 are disposed in the fan-outarea 104 on the in-cell touch display panel 100. The driving circuit 110is electrically connected to the display pads 121-124 and the touch pads131-134. The display pads 121-124 are electrically connected to the datalines D1-D4 respectively and the touch pads 131-134 are electricallyconnected to the sensing lines S1-S4 respectively. In particular, alongthe X direction, one of the display pads is disposed between two of thetouch pads, and one of the touch pads is disposed between two of thedisplay pads. For example, the display pad 122 is disposed between thetouch pad 131 and the touch pad 132, and the touch pad 131 is disposedbetween the display pad 121 and the display pad 122. In the embodimentof FIG. 1, the display pads 121-124 and the touch pads 131-134 aredisposed in an interleaved way. In prior art (not shown), the displaypads and the touch pads are arranged in a same row in a driving circuit,and the display pads are continuously disposed, and then the touch padsare continuously disposed next to the display pads, and thus the datalines D1-D4 would be overlapped with the sensing lines S1-S4 in thefan-out area 104. However, as shown in FIG. 1, the data lines D1-D4 areparallel with the sensing lines S1-S4 in the display area 101, and theydo not overlap with each other in the non-display area 102 because thedisplay pads 121-124 and the touch pads 131-134 are disposed in theinterleaved way.

In some embodiments, the driving circuit 110 is disposed on a flexiblecircuit board such as a Tape Carrier Package (TCP) or a Chip on Film(COF). Alternatively, the driving circuit 110 may be disposed on thethin film transistor substrate. In addition, the driving circuit 110 maybe a Touch and Display Driver Integration (TDDI) single chip providingdisplay and touch functions simultaneously. Or, the driving circuit 110may include multiple chips which provide display function and touchfunction respectively. The driving circuit 110 may be a Gate-Driver InPanel(GIP) or an Integrated Gate Driver (IGD). Moreover, the number ofthe driving circuit 110 may be greater than one that are disposed at twosides (e.g. upper side and lower side, or left-hand side and right-handside) of the panel or disposed just one side of the panel.

Every four pixel structures share one touch electrode In FIG. 1, butmore or less pixel structures may share one common electrode in otherembodiments. In addition, the number of the data lines D1-D4 is equal tothe number of the sensing lines S1-S4 in FIG. 1, but in practice, everypixel structure (also referred to sub-pixel) generally renders a singlecolor, and a pixel is composed of three sub-pixels which are generallyarranged along the X direction. Therefore, the resolution of the pixelstructures along the X direction is greater than the resolution of thepixel structures along the Y direction. In some embodiments, at leasttwo of the sensing lines are connected to each other and then iselectrically connected to one touch pad though a conductive line. Forexample, referring to FIG. 2, FIG. 2 is a schematic diagram illustratingconnection between the sensing lines and the driving circuit inaccordance with an embodiment. For simplification, conductive lines suchas the data lines and the gate lines are not shown in FIG. 2. In theembodiment of FIG. 2, each of the touch electrodes C11, C21, and C31includes 27 pixel structures arranged as 3 rows and 9 columns. At leastone of the sensing lines S1-S3 is electrically connected to the touchelectrode C11 through a contact hole 210, and the sensing lines S1-S3are connected to each other in the signal line transferring area 103,and then are electrically connected to one touch pad in the drivingcircuit 110 through a conductive line 201. At least one of the sensinglines S4-S6 is electrically connected to the touch electrode C21 throughthe contact hole 210, and the sensing lines S4-S6 are connected to eachother in the signal line transferring area 103, and then they areelectrically connected to one touch pad in the driving circuit 110through a conductive line 202. At least one of the sensing lines S7-S9is electrically connected to the touch electrode C31 through the contacthole 210, and the sensing lines S7-S9 are connected to each other in thesignal line transferring area 103, and then they are electricallyconnected to one touch pad in the driving circuit 110 through aconductive line 203. In the embodiment of FIG. 2, two of the sensinglines S1-S3 are electrically connected to the touch electrode C11through two contact holes 210, one of the sensing lines S4-S6 iselectrically connected to the touch electrode C21 through one contacthole 210, and three of the sensing lines S7-S9 are electricallyconnected to the touch electrode C31 through three contact holes 210.The number of sensing lines that each touch electrode is electricallyconnected to is not limited in the invention. For example, if there arefive sensing lines passing through one touch electrode, then the touchelectrode may be electrically connected to any number (e.g. one of 1 to5) of the five sensing lines.

In addition, each pixel structure corresponds to at least one data line,and each data line is connected to one display pad. In other words, thenumber of the display pads is greater than the number of touch pads. Inthe embodiment of FIG. 2, one touch pad is disposed between every threedisplay pads, and thus the sensing lines and the data lines are notoverlapped with each other in the non-display area 102.

FIG. 3A to FIG. 3F are schematic diagrams illustrating disposition ofdisplay pads and touch pads in accordance with some embodiments. Forsimplification, the data lines and the sensing lines are not shown inFIG. 3A to FIG. 3F.

Referring to FIG. 3A, in some embodiments, the display pads and thetouch pads are arranged along the Y direction, as a first row 301, asecond row 302 and a third row 303. The first row 301 only includes thetouch pads TP, the second row 302 and the third row 303 only include thedisplay pads DP. In this embodiment, all touch pads are disposed in thefirst row 301, but all touch pads may be arranged as several rows inother embodiments. In addition, the touch pads TP are disposed on thetop in FIG. 3A, that is, the touch pads TP are disposed between thedisplay area and the display pads DP. FIG. 3B is similar to FIG. 3A, inwhich the display pads and the touch pads are arranged along the Ydirection, as a first row 311, a second row 312 and a third row 313. Thesecond row 312 and the third row 313 only include the display pads DP,and the first row 311 only includes the touch pads TP. However, thetouch pads TP are disposed on the bottom in FIG. 3B, that is, thedisplay pads DP are disposed between the display area and the touchpads.

In FIG. 3C, the display pads and the touch pads are arranged along the Ydirection, as a first row 321 and a second row 322. The first row 321only includes a portion of the display pads DP, and the second row 322includes a portion of the display pad DP and the touch pads TP. Thetouch pads TP are inserted into the display pads DP of the second row322 in FIG. 3C. The first row 321 is disposed on the top, that is, thefirst row 321 is disposed between the display area and the second row322. FIG. 3D is similar to FIG. 3, but the difference between FIG. 3Cand FIG. 3D is that the second row 332 having the touch pads TP and thedisplay pads DP is disposed on the top, that is, the second row 332 isdisposed between the display area and the first row 331. The touch padsTP are inserted into the display pads DP of the second row 332 as shownin FIG. 3D.

In FIG. 3E, the display pads and the touch pads are arranged along Ydirection, as a first row 341, a second row 342, a third row 343 and afourth row 344. The first row 341 only includes touch pads TP; thesecond row 342, the third row 343 and the fourth row 344 only includedisplay pads DP. Moreover, the touch pads TP are overlapped with thedisplay pads DP along Y direction.

In FIG. 3F, the touch pads TP are evenly distributed in the first row351, the second row 352 and the third row 353. In the same row, threedisplay pads DP are disposed between two adjacent touch pads TP. Inaddition, the same number of display pads DP are distributed in any twotouch pads TP. The touch pads TP are not overlapped with each otheralong Y direction.

In the embodiments of FIG. 3A to FIG. 3F, the width of each touch pad TPalong the X direction is equal to that of each display pad DP. However,in other embodiments, the width of each touch pad TP along the Xdirection may be wider than that of the display pad DP, which is notlimited in the invention. Note that the description of “one display padis disposed between two touch pads along X direction” may be interpretedas “the projection of one display pad onto X axis is disposed betweenthe projections of two touch pads onto X axis”, and thus it encompassthe embodiments of FIG. 3A to FIG. 3F. For example, in FIG. 3E, thedisplay pads 347 is disposed between the touch pads 345 and the touchpads 346 along X direction, and the touch pads 346 is disposed betweenthe display pads 347 and the display pads 348. From another aspect, aprojection of the display pads 347 onto X axis is located between twoprojections of the touch pads 345 and the touch pads 346 onto X axis. Aprojection of the touch pads 346 onto X axis is between two projectionsof the display pads 347 and the display pads 348 along X axis. Thedescription may be applied to FIG. 3A to FIG. 3D and FIG. 3F, and thedescription will not be repeated.

FIG. 4 is a top view of a pixel structure in accordance with anembodiment. FIG. 5 is a cross-sectional view of the pixel structure ofFIG. 4 along a cross-sectional line AA′. Referring to FIG. 4, a pixelstructure 410 is taken as an example. The pixel structure 410 includes aTFT 420, a pixel electrode PE and a common electrode (not shown). TheTFT 420 includes a gate 420G, a source 420S and a drain 420D. A gateline 430 formed by a second metal layer M2 is connected to the gate420G. A data line 431 formed by a third metal layer M3 is connected tothe source 420S. In addition, a sensing line 432 is formed by a firstmetal layer M1 and is connected to the common electrode (i.e. touchelectrode) through a via. The sensing line 432 is disposed at theleft-hand side of the data line 431 in the embodiment, but the sensingline 432 may be disposed at the right-hand side of the data line 431 inother embodiments.

Referring to FIG. 4 and FIG. 5. The first metal layer M1 is formed on asubstrate SUB and includes the sensing line 432. A first insulationlayer INS1 is formed on the first metal layer M1 and has an openingOP_51 to expose the sensing line 432. The second metal layer M2 isformed on the first insulation layer INS1 and includes the gate 420G. Asecond insulation layer INS2 is formed on the second metal layer M2 andincludes an opening OP_52 corresponding to the opening OP_51. A firsttransparent conductive layer TC1 is formed on the second insulationlayer INS2 and includes the pixel electrode PE. A semiconductor layer420C is formed on the second insulation layer INS2 as a channel of theTFT. An ohmic contact layer (not shown) is formed on the semiconductorlayer 420C. The third metal layer M3 is formed on the semiconductorlayer 420C and includes the source 420S, the drain 420D and a metalconnection structure 440. The metal connection structure 440 iselectrically connected to the sensing line 432 through the opening OP_52and the opening OP_51. The drain 420D contacts the pixel electrode PE. Athird insulation layer INS3 is formed on the third metal layer M3 andhas an opening OP_53 corresponding to the opening OP_52. A secondtransparent conductive layer TC2 is formed on the third insulation layerINS3 and includes a touch electrodes TE (i.e. common electrode). Thetouch electrode TE is electrically connected to the sensing line 432through the openings OP_53, OP_52, and OP_51. In the embodiment, thetouch electrode TE includes slits 512S.

In the display period, a common voltage is applied to the touchelectrode TE, and the electric field between the touch electrode TE andthe pixel electrode PE is used to control the orientation of liquidcrystal. In the touch sensing period, the voltage of the touch electrodeTE is transmitted to the driving circuit through the sensing line 432 togenerate a touch sensing signal. In the embodiment of FIG. 5, the touchelectrode TE is disposed above the pixel electrode PE, but the touchelectrode TE may be disposed beneath the pixel electrode PE.

In some embodiments, the first insulation layer INS1 and the secondinsulation layer INS2 have same material and are formed by the sameprocess (including pressure, temperature and time, etc.), and thus theetching rates thereof are the same. After etching the first insulationlayer INS1 and the second insulation layer INS2 to form the openingOP_51 and the opening OP_52 respectively, the first insulation layerINS1 has a first side 521 in the opening OP_51 and the second insulationlayer INS2 has a second side 522 in the opening OP_52. The first side521 and the second side 522 form a downhill surface.

In some embodiments, the first insulation layer INS1 and the secondinsulation layer INS2 have the same material but different processes.The etching rate of the first insulation layer INS1 is less than that ofthe second insulation layer INS2 by modifying the process (e.g.temperature, pressure and/or time), and thus a situation of under-cutwill not occur at a side of the first insulation layer INS1. On theother hand, the metal connection structure 440 is formed between thetouch electrode TE and the sensing line 432 to prevent the touchelectrode TE from breaking due to too deep hole.

Referring to FIG. 4, a connection structure 450 is disposed in thesignal line transferring area 103 for transferring the sensing line 432into another metal layer. In the embodiment, the sensing line 432includes a first portion 461 and a second portion 462. The first portion461 is formed by the first metal layer M1, and the second portion 462 isformed by the third metal layer M3. In other words, the connectionstructure 450 is used to transfer the sensing line 432 from the firstmetal layer M1 into the third metal layer M3. In other embodiments, theconnection structure 450 may transfer the sensing line 432 into thesecond metal layer M2. In some embodiments, the connection structure 450does not exist for maintaining the sensing line 432 in the first metallayer M1. In some embodiments, the connection structure may be disposedon the data line 431 to transfer the data line 431 into the first metallayer M1 or the second metal layer M2. In some embodiments, among twoadjacent data lines 431, the connection structure is disposed on one ofthe data lines to transfer it into the second metal layer M2 but not onthe other data line, and thus these two data lines do not overlap in thefan-out area 104. FIG. 6 is a cross-sectional view of the connectionstructure 450 in accordance with an embodiment. Referring to FIG. 6, thefirst portion 461 is formed on the substrate SUB. The first insulationlayer INS1 has an opening OP_64 to expose the first portion 461. Thesecond insulation layer INS2 has an opening OP_65 corresponding to theopening OP_64. The second portion 462 is formed on the second insulationlayer INS2. The third insulation layer INS3 has an opening OP_66 and anopening OP_67. The opening OP_66 corresponds to the opening OP_65 andthe opening OP_64. The opening OP_67 exposes the second portion 462. Thesecond transparent conductive layer TC2 is electrically connected to thesecond portion 462 through the opening OP_67, and is electricallyconnected to the first portion 461 through the opening OP_66, theopening OP_65, and the opening OP_64. The connection structure of FIG. 6may be disposed on the data line to transfer the data line from thethird metal layer into the first metal layer.

FIG. 7 is a cross-sectional view of the connection structure 450 inaccordance with an embodiment. The difference between FIG. 7 and FIG. 6is an additional metal connection layer 710 formed by the third metallayer M3. The metal connection layer 710 is formed between the secondtransparent conductive layer TC2 and the first portion 461 and is indirect contact with them. The metal connection layer 710 is used toprevent the second transparent conductive layer TC2 from breaking due toa too deep hole formed by the opening OP_66, the opening OP_65, and theopening OP_64.

The material of the aforementioned substrate may include glass, polymer,polyethylene terephthalate (PET), polycarbonate (PC), polyether sulfone(PES), triacetyl cellulose (TAC), PMMA, polyethylene, COP, polyimide(PI), and a compound material constituted by PC and PMMA, which is notlimited in the invention. The material of the transparent conductivelayer TC1 and TC2 may include indium tin oxide (ITO), indium zinc oxide(IZO), antimony tin oxide (ATO), fluorine tin oxide (FTO) or otherconductive and transparent material such as a Nano-metal wire (e.g.nano-silver wire, nano-copper wire). The metal layer in thespecification may be a single layer of aluminum, copper, titanium,tungsten, etc. or a compound layer of molybdenum-aluminum-molybdenum,titanium-aluminum-titanium, titanium-copper-titanium, etc. which is notlimited in the invention. On the other hand, the insulation layer in thespecification may be silicon nitride, silicon oxide, silicon oxynitrideor other suitable insulation layers. Furthermore, one insulation layershown in the figures may include two or more than two insulation layersstacked with each other with different material.

Although the present invention has been described in considerable detailwith reference to certain embodiments thereof, other embodiments arepossible. Therefore, the spirit and scope of the appended claims shouldnot be limited to the description of the embodiments contained herein.It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims.

What is claimed is:
 1. An in-cell touch display panel having a displayarea and a non-display area, the in-cell touch display panel comprising:a plurality of gate lines and a plurality of data lines that areintersected with each other on a substrate; a plurality of sensing linesdisposed on the substrate; a plurality of pixel regions disposed inareas where the gate lines are intersected with the data lines, whereineach of the pixel regions has a pixel structure, and each of the pixelstructures comprises a pixel electrode formed by a first transparentconductive layer; a touch electrode formed by a second transparentconductive layer, wherein the touch electrode corresponds to more thanone of the pixel electrodes; a thin film transistor formed in each ofthe pixel structures, wherein the thin film transistor comprises a gate,a source, a drain and a semiconductor layer, the source is electricallyconnected to one of the data lines, the gate is electrically connectedto one of the gate lines, and the drain is electrically connected to oneof the pixel electrodes; a first insulation layer formed on the sensinglines and having a first opening to expose one of the sensing lines,wherein the gate is formed on the first insulation layer; a secondinsulation layer formed on the gate lines and having a second openingcorresponding to the first opening, wherein the source is formed on thesecond insulation layer; and a third insulation layer formed on thesource and having a third opening corresponding to the second opening,wherein the touch electrode is formed on the third insulation layer, andthe touch electrode is electrically connected to one of the sensinglines through the third opening, the second opening and the firstopening.
 2. The in-cell touch display panel of claim 1, wherein thefirst insulation layer and the second insulation layer have samematerial, the first insulation layer has a first side in the firstopening, the second insulation layer has a second side in the secondopening, and the first side and the second side form a downhill surface.3. The in-cell touch display panel of claim 2, further comprising ametal connection structure having same material as the data lines,wherein the metal connection structure is formed between the touchelectrode and the one of the sensing lines.
 4. The in-cell touch displaypanel of claim 2, wherein an etching rate of the first insulation layeris less than an etching rate of the second insulation layer.
 5. Thein-cell touch display panel of claim 1, further comprising a pluralityof display pads and a plurality of touch pads in the non-display area,wherein each of the data lines is electrically connected to one of thedisplay pads, wherein each of the sensing lines is electricallyconnected to one of the touch pads, wherein one of the display pads isdisposed between two of the touch pads, and one of the touch pads isdisposed between two of the display pads.
 6. The in-cell touch displaypanel of claim 5, wherein a number of the touch pads is less than anumber of the display pads, the display pads and the touch pads arearranged as a plurality of rows, and one of the rows only consists ofthe touch pads.
 7. The in-cell touch display panel of claim 5, wherein anumber of the touch pads is less than a number of the display pads, thedisplay pads and the touch pads are arranged as a plurality of rows, afirst row of the rows consists of a portion of the display pads, and asecond row of the rows comprises a portion of the display pads and aportion of the touch pads.
 8. The in-cell touch display panel of claim5, wherein a number of the touch pads is less than a number of thedisplay pads, and the display pads and the touch pads are arranged as aplurality of rows, wherein in one of the rows, a same number of thedisplay pads are disposed between any two of the touch pads.
 9. Thein-cell touch display panel of claim 1, wherein the non-display areacomprises a signal line transferring area and a fan-out area, wherein inthe display area, the sensing lines are formed by a first metal layer,wherein in the signal line transferring area, one of the sensing linesor one of the data lines is transferred to another metal layer through aconnection structure.
 10. The in-cell touch display panel of claim 9,wherein one of the sensing lines comprises a first portion and a secondportion, and the connection structure comprises: the first portionformed by the first metal layer; the first insulation layer having afourth opening to expose the first portion; the second insulation layerhaving a fifth opening corresponding to the fourth opening; the secondportion formed by a third metal layer on the second insulation layer;the third insulation layer having a sixth opening and a seventh opening,wherein the sixth opening corresponds to the fourth opening, and theseventh opening exposes the second portion; and the second transparentconductive layer electrically connected to the second portion throughthe seventh opening and electrically connected to the first portionthrough the fourth opening, the fifth opening, and the sixth opening.11. The in-cell touch display panel of claim 10, wherein the connectionstructure further comprises a metal connection layer formed by the thirdmetal layer, wherein the metal connection layer is formed between thesecond transparent conductive layer and the first portion.